Metrology

Process Overview Inspection and metrology tools ensure quality control and process monitoring throughout semiconductor manufacturing. Think of these as the "quality control police" of the fab. Maj

### Process Overview Inspection and metrology tools ensure quality control and process monitoring throughout semiconductor manufacturing. Think of these as the "quality control police" of the fab. ### Major Equipment Categories #### 1. Optical Inspection Systems - Manufacturers: - KLA (29xx series) - Applied Materials (UVision®) - ASML (YieldStar) - Cost: - Brightfield: $4-8 million - Darkfield: $3-6 million - Applications: - Pattern defects - Particles - Scratches - Resolution: down to 10nm #### 2. E-Beam Inspection - Manufacturers: - JEOL - Hitachi High-Tech - Applied Materials - Cost: $7-12 million - Resolution: <1nm - Throughput: 1-2 wafers/hour #### 3. Metrology Tools ##### CD-SEM - Manufacturers: - Hitachi High-Tech - Applied Materials - Cost: $3-5 million - Precision: <0.1nm - Throughput: 30-40 wafers/hour ##### Optical CD - Manufacturers: - KLA - Nova Measuring - Cost: $2-4 million - Applications: - Line width - Profile measurement ##### Film Thickness - Manufacturers: - KLA-Tencor - Nanometrics - Nova - Cost: $1-3 million - Types: - Ellipsometer - Reflectometer ### Software & Analysis Systems #### Recipe Generation - Suppliers: - KLA - Applied Materials - Cost: $200,000-500,000/year - AI/ML integration #### Defect Classification - Advanced AI systems - Pattern recognition - Cost: $300,000-700,000/year ### Facility Requirements - Class 1 cleanroom areas - Vibration isolation - EMI shielding - Temperature control: ±0.1°C - Setup cost: $15-25 million ### Technical Specifications #### Optical Systems - Defect size: >10nm - Throughput: 100-200 wafers/hour - False count rate: <0.1/cm² - Review capability: >95% #### E-Beam Systems - Defect size: >1nm - Voltage range: 100V-30kV - Stage precision: <10nm - Imaging modes: SE, BSE #### Metrology - CD precision: <0.1nm - Thickness precision: <0.1% - Overlay accuracy: <1nm - Tool-to-tool matching: <1% ### Market Analysis - Leaders: - KLA (~40%) - Applied Materials (~25%) - Hitachi High-Tech (~15%) - Annual market: ~$7B - Growth rate: 15-20%/year ### Support Infrastructure 1. Data Management - Yield management systems - Statistical process control - Cost: $1-3 million/year 2. Sample Preparation - FIB systems - Sample cleaners - Cost: $500,000-1 million ### Technical Challenges 1. Advanced Nodes: - Sub-nanometer detection - 3D structure measurement - High aspect ratio inspection - Edge placement error 2. Production: - False defect reduction - Through-silicon measurement - High-speed review - Cost of ownership ### Applications 1. In-line Control: - Critical dimension - Overlay - Defect inspection - Film thickness 2. Engineering Analysis: - Failure analysis - Process development - Yield improvement ### Future Trends - AI/ML defect classification - Hybrid metrology - In-situ measurements - Multi-column e-beam - Cloud connectivity ### Maintenance Requirements - Daily calibration - Weekly preventive maintenance - Quarterly source replacement - Annual cost: $200,000-400,000

By Eduarda Ferreira